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Meet the dedicated professionals behind the 2026 1st International Electronics, Packaging, Design & Manufacturing Conference: Bridging Skills & Innovation for India's Industry
Department of Computer Science and Engineering, Sree Rama Engineering College, Tirupati, Andhra Pradesh, India
Department of Computer Science and Engineering, Sree Rama Engineering College, Tirupati, Andhra Pradesh, India
Swiss School of Business and Management, Switzerland
Riga Nordic University, Latvia
Full Stack Engineer, United States
Microsoft, USA
University of Technology and Applied Sciences-Suhar, Sultanate of Oman
Jazan University, Saudi Arabia
Kampala International University, Uganda
JSS Academy of Technical Education, India
DY Patil Deemed to be university, India
Jazan University, Jizan, Saudi Saudi Arabia
Vellore Institute of Technology, Vellore Campus, Vellore, Tamil Nadu, India
Bishop Heber College. India
B. V. Raju Institute of Technology, India
Utilities Americas, LTIMindtree, USA
IT Systems Architect, USA
Microsoft Corporation, Charlotte NC, Charlotte, USA
Alliance University, Bangaluru
Mouri Tech Limited Vaishnavi’s Iconic, Hyderabad
Dayananda Sagar Academy of Technology and Management, Bangalore
VIT,Vellore
SRMIST,Chennai
Jain University, Bangalore
MIT Bengaluru
SRMIST-Trichy
SIMATS,Chennai
Mahasarakham University, Thailand
Riga Technical University, Latvia
The University of Waikato, New Zealand
Université de Technologie de Compiègne, France
Universidad Politécnica de Valencia, Spain
Chandigarh University India